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Showing posts with the label Advanced IC Substrates Market Growth

Advanced IC Substrates Market Share, Business, Technology, Application And Growth, Rate Upto 2029

  The advanced substrate business is following downsizing, integration, and performance trends, resulting in considerable investments by many partners in the ongoing ED and SLP packaging. Thermal gains result from higher power density and board integration, allowing for even greater system dependability improvements. This technology brings a lot of value to the market because of its wide application in automotive applications. It's especially significant in the telecommunications and infrastructure sectors, where ED serves as a good substrate for increasing hardware efficiency. As a result, stakeholders are investing in new factories where ED will be the key product component. Advanced IC Substrates Market Overview: The latest research conducted by Maximise Market Research unveils insights into the dynamic  Advanced IC Substrates Market . This comprehensive analysis delves into key aspects such as prominent competitors and their market segments, corporate strategies, global ex...